Challenging the Pinnacle of Technology: Case Study on Screening Adoption
Super high-reliability super micro sieve used for the classification of functional particles (to standardize particle size).
- Established microfabrication technology with a hole diameter of 5 μm, pitch of 15 μm, and plate thickness of 50 μm, surpassing the "technological limit wall" through electroforming methods. We are further challenging what lies beyond. - We contribute to the commercialization of our users' new business fields with manufacturing technology that achieves high precision, high strength, high open area ratio, and ultra-high aspect ratio (plate thickness ÷ hole diameter) all at once. - We also accept contracts for the production of non-circular "irregular hole products."
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.