[Ultra-Fine Processing] Super Micro Sieve Technology * Comparison Table of Methods & Introduction of Processing Examples
Established ultra-fine processing technology with a hole diameter of 5μm, pitch of 15μm, plate thickness of 50μm, and an ultra-high aspect ratio (plate thickness ÷ hole diameter)! *Introducing freely customizable non-circular hole processing.
Our company contributes to high reliability, high quality, and application-specific design through ultra-fine processing and ultra-high precision sieves using electroforming technology, as well as the development and contract manufacturing of high-pressure irregular holes. We have developed the ultra-reliable 'sieve' super micro sieve and the classification device 'S-150W' that has perfected non-clogging classification technology, and we will continue to pursue innovative technologies in the future. 【Features of Super Micro Sieve Technology for Ultra-Fine Hole Processing】 - A technology that does not allow other electroforming techniques, etching, laser, drilling, milling, or electrical discharge machining to compete. - Achieves an astonishing opening rate of 22.7% with a hole diameter of φ10μm. - No reinforcement is needed from support mesh (which typically reduces opening area by several tens of percent) as seen in conventional electroformed sieves. - Capable of creating approximately 160 million holes of 5μm in diameter over an area of 20 centimeters. - Remarkable thickness of ≪30–100μm≫ with hardness HV600, which does not break even when dented. etc. *For more details, please download the comparison table of methods and examples of processing, or feel free to consult us.
basic information
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Applications/Examples of results
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