What is the 5-micron round hole microfabrication technology of Super Micro Sieve?
Unlike conventional micro-hole processing methods, Semtech Engineering's unique technology enables classification with a minimum of 5μm using electroforming technology.
High-precision micro-hole processing that cannot be achieved with conventional etching, lasers, drilling, milling, or electrical discharge machining is possible. ~ A must-see for those attending POWTEX(R) 2024, the 25th International Powder Technology Exhibition in Tokyo ~ Our super micro sieve is produced using electroforming technology. "Processing hole diameters from 5μm to over 30μm" allows for the complete removal of coarse particles mixed in the manufacturing process at the individual level. "Minimum pitch of hole diameter + 10μm" enables high-efficiency classification due to the large number of holes per unit area. "Cross-sectional roughness: mirror finish, hardness HV600" prevents particle clogging due to the smooth cross-sectional structure. "Aspects ratio: 10" provides incredible thickness of 50μm, allowing it to withstand ultrasonic vibrations. Quality assurance through high precision, work efficiency due to high pressure resistance, and high processing capacity due to an impressive opening rate. The shape of the holes can be designed from perfect circles to irregular shapes. We offer design, development, and contract manufacturing tailored to our customers' applications. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
Q: What is electroforming technology? A: It is a technology that combines semiconductor technology and electroplating technology to create products with fine structures. Our company manufactures fine products by using pillars refined through exposure to patterned photosensitive resin and performing nickel plating. *For more details, please refer to the PDF document or feel free to contact us.
Price information
It varies depending on the sieve hole diameter, sieve outer diameter, pattern area diameter, etc. We will respond after confirming the details.
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Applications/Examples of results
<<Our Production Examples>> - Example 1: Classification of silica particles for spacers used in the assembly of LCD panels - Example 2: Classification of anisotropic conductive particles used for fine-pitch connections in LCD panels - Example 3: Particle selection for new application development (sieve outer diameter 15-25 mm) - Example 4: Quality control filters for particle manufacturing processes (sieve outer diameter 25-60 mm) - Example 5: Classification of ultra-fine industrial diamonds for mounting on dicing saws and wire saws - Consideration examples: Medical analysis columns, DNA analysis chips, solder balls, particle size selection, spinning nozzles, microchannels, liquid spray nozzles... and others.
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.