High-precision particle classification sieve
High Value-Added Fine Particle Development" and "Highest Quality Particle Manufacturing" The key lies in the "Sieve" - "Super Micro Sieve.
- Example 1: Liquid crystal panel spacer - Silica particles - Example 2: Liquid crystal panel high-density mounting - Anisotropic conductive particles - Example 3: Particles - Development of new applications - Sieve outer diameter 15-25 mm - Example 4: Particle manufacturing process - Quality control - Sieve outer diameter 25-60 mm - Example 5: Dicing saw - Wire saw - Industrial diamond classification - Consideration example: Medical analysis column, DNA analysis chip, solder balls, particle size selection, spinning nozzle, microchannel, liquid spray nozzle... and others - (Contract classification) (We offer paid contract classification tailored to the customer's application)
basic information
- Our company manufactures products using a method that combines a semiconductor manufacturing technology called "electroforming" with electroplating. - The characteristic of this technology is that it enables the processing of high-precision fine holes and grooves that are impossible to achieve with machining methods such as drilling, laser, or electrical discharge machining. For example, it is possible to process holes with a diameter of 5 μm. - One of the significant features of our technology is "high aspect ratio processing." For example, processing a hole with a diameter of 5 μm at a pitch of 15 μm in a plate thickness of 50 μm results in a thickness-to-hole diameter ratio of 10 (generally, it is 1 to 2). - The material is produced using the electroplating method, and in our case, it is nickel with a hardness of HV600. - When used for sieves, high aspect ratio and material hardness are extremely important. Our sieves are used for applications that require the complete removal of coarse particles at the individual level. - The standard hole shape is round (note: in the case of high aspect ratio, the corners of square holes will be rounded). *For more details, please download the PDF or feel free to contact us.
Price information
It varies depending on the sieve hole diameter, sieve outer diameter, pattern area diameter, etc. We will respond after confirming the details.
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
