What is 5μm round hole microfabrication technology? An explanation comparing it with conventional microhole processing is underway!
A "sieve" used for sorting fine particles used in devices such as LCD TVs and smartphones. A technology that achieves high durability and high precision fine processing with an aspect ratio of 10 times!
In this document, we summarize the differences between our "Super Micro Sieve Technology," which achieves high-precision fine hole processing, and conventional methods such as etching, laser, drilling, milling, and electrical discharge machining. Additionally, we have included "processing examples" with photographs! Our Super Micro Sieve (for particle screening) is produced using electroforming technology. ■ Features - "Hole diameter processing from 5μm to over 30μm" allows for the complete removal of coarse particles at the individual level during the manufacturing process. - "Minimum pitch of hole diameter + 10μm" enables high-efficiency classification due to the large number of holes in a single area. - "Cross-sectional roughness: mirror finish, hardness HV600" ensures that particles do not clog due to the smooth cross-sectional structure. - "Aspect ratio of 10" provides remarkable strength with a thickness of 50μm, allowing it to withstand ultrasonic vibrations. We offer quality assurance through advanced precision, work efficiency due to high pressure resistance, and high processing capacity due to an impressive opening rate. The shape of the holes can also be designed from perfect circles to irregular shapes. *For more details, please download the comparison table of methods and processing examples, or feel free to contact us.
basic information
Q: What is electroforming technology? A: It is a technology that combines semiconductor technology and electroplating technology to create products with fine structures. Our company manufactures fine products by using pillars refined through exposure to photosensitive resin via pattern molding and performing nickel plating. Q: What is aspect ratio? A: In microfabrication, it represents the relationship between the dimensions of a hole or groove width and the thickness of the product. The aspect ratio is calculated as plate thickness ÷ hole diameter, and the larger this value, the more robust it becomes. *For more details, please refer to the PDF document or feel free to contact us.
Price information
It varies depending on the sieve hole diameter, sieve outer diameter, pattern area diameter, etc. We will respond after confirming the details.
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Applications/Examples of results
<<Our Production Examples>> - Example 1: Classification of silica particles for spacers used in the assembly of LCD panels - Example 2: Classification of anisotropic conductive particles used for fine-pitch connections in LCD panels - Example 3: Particle selection for new application development (sieve outer diameter 15-25 mm) - Example 4: Quality control filters for particle manufacturing processes (sieve outer diameter 25-60 mm) - Example 5: Classification of ultra-fine industrial diamonds for mounting on dicing saws and wire saws - Consideration examples: Medical analysis columns, DNA analysis chips, solder balls, particle size selection, spinning nozzles, microchannels, liquid spray nozzles... and more
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.