4-3 【Original Technology】 Super Micro Sieve Strength Test
The important factor in screening is the strength of the screen. Since screen damage can have a significant impact on the product, we verify quality through rigorous testing.
■ The photo in the center shows a dent created when the tip of a flathead screwdriver was dropped from 7 cm above the sieve surface. The "Super Micro Sieve" is a sieve that can withstand formidable damage. ■ The photo on the right shows the condition of a hole that was damaged during use in a typical sieve. "If it breaks, coarse particles will naturally mix into the product." ■ The aspect ratio is an indicator used to evaluate the technical level of sieves. 1. Our company: Plate thickness (50) ÷ Hole diameter (5) = Aspect ratio 10, high strength. 2. Competitor: Plate thickness (10) ÷ Hole diameter (5) = Aspect ratio 2, thin, risk of damage. Challenge: ■ We are currently developing fine holes with small diameters of Φ1, Φ3, and Φ5 μm. ■ While we anticipate technical challenges, the more difficult the problem, the more innovative ideas emerge. ■ The current minimum hole diameter is Φ5 μm, but we are challenging ourselves to create even finer holes.
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