Semiconductor manufacturing equipment
Semiconductor manufacturing equipment
Introduction of a photonic debonding device that achieves ultra-fast adhesive removal This is a new TBDB solution that instantaneously converts light into heat to remove adhesives. - Clean and load-free as there is no residue - High-speed processing with wide-area irradiation - Excellent cost benefits - Main targets: panels (PLP), wafers (WLP), TSV, and others
1～2 item / All 2 items
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Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process.
Ultra-fast, clean, and low-load. Why not optimize the TBDB (temporary bonding and debonding) process with a photonic debonding device?
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Precision Dispenser Entry Model Quspa-Dx
Bringing precision dispensing closer to you. Precision dispenser 'Quspa-Dx'.
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