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Ultra-Precision Dispenser Quspa Series(4)
New Common Sense in the Dispensing Industry Shinwa Ultra-Precision Dispenser 'Quspa' ● Semiconductor Backend Processes (Mainly Flip-chip Underfill) → Achieves high precision and high-speed processing! X-Y Repetition Accuracy: ±5μm → Reduction in the number of equipment investments due to increased speed → Improved stability of application volume through room temperature dispensing → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: 170μm) ◆ Ag Paste ◆ UV Curing Resin Others
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Non-destructive testing equipment(1)
Introduction of a non-destructive and high-speed inspection device for detecting cracks and voids inside metals. We provide a new solution for various inspection targets that traditionally relied on destructive testing methods such as pull tests and shear tests, or visual inspections. - Detects internal cracks and voids in metals, as well as joint strength, which cannot be confirmed through visual inspection. - High-speed processing allows for the possibility of 100% inspection. - No damage to the inspection target. - Main inspection targets: interposers, wire bonding, solder bumps, and others.
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Semiconductor manufacturing equipment(1)
Introduction of a photonic debonding device that achieves ultra-fast adhesive removal This is a new TBDB solution that instantaneously converts light into heat to remove adhesives. - Clean and load-free as there is no residue - High-speed processing with wide-area irradiation - Excellent cost benefits - Main targets: panels (PLP), wafers (WLP), TSV, and others
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Jinwa Jet Pump Series(5)
New Norms in the Dispensing Industry [Shinwa Jet Dispenser] ◎ Compatible with 0402/0201 solder jet dispensing ◎ Compatible with flip chip underfill - Supports high-density mounting, achieving precise application in extremely small spaces - Reduces the number of equipment investments through faster dispensing - Increases stability of dispensing volume with room temperature discharge - Significantly reduces yield loss and improves production efficiency [Applications] ◆ Flip Chip Underfill ◆ MEMS & HDD ◆ LED Phosphors in general (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: 170μm) ◆ Ag Paste ◆ UV Curing Resin Others
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Jinwa Screw Pump Series(1)
Dispensing Industry Top-Class Performance 【Shinwa Screw Dispenser】 - LED Post-Processing / PCB Mounting Process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments due to increased application speed (Compared to air dispensers: 2 to 5 times processing capacity) → Increased stability of application amount due to room temperature discharge → Significant reduction in yield loss and increased production efficiency 【Applications】 ◆ Secondary Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (φ250~φ300μm) * The application diameter may vary depending on the solder particle used ◆ Ag Paste ◆ UV Curing Resin Others