Jet dispenser for cream solder application
Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.
The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.
basic information
Jet Dispenser - Semiconductor back-end process / LED back-end process → Supports high-density mounting → Achieves non-contact micro-dispensing on uneven substrates and in extremely small spaces → Reduces the number of equipment investments through high-speed dispensing → Increases stability of dispensing amount due to room temperature discharge → Significantly reduces yield loss and improves production efficiency *For more details, please refer to the PDF document or contact us directly.
Price information
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Delivery Time
Model number/Brand name
SPJ-22A
Applications/Examples of results
【Wide-ranging achievements in various industries/materials】 ● Semiconductor Backend ● Underfill / Dam & Fill / Cream Solder / Ag Paste / UV Curing Resin, etc. ● LED Backend ● General Phosphor Dispensing (SMD/PLCC/Dam & Fill, etc.) COB Packages (5mg to 360mg) ● PCB Assembly ● Cream Solder / Ag Paste / Moisture-proof Material / UV Curing Resin, etc. ● HDD Backend ● Ag Paste / Thermosetting Resin / 3D Dispensing, etc. ● MEMS ● Ag Nano Paste / UV Nano Paste, etc.
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News about this product（2）
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Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Free sample testing currently in progress
Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
