Shinwa Co., Ltd. Mechatronics System Center Official site

Jinwa Jet Pump Series

Jinwa Jet Pump Series

Jinwa Jet Pump Series

New Norms in the Dispensing Industry [Shinwa Jet Dispenser] ◎ Compatible with 0402/0201 solder jet dispensing ◎ Compatible with flip chip underfill - Supports high-density mounting, achieving precise application in extremely small spaces - Reduces the number of equipment investments through faster dispensing - Increases stability of dispensing volume with room temperature discharge - Significantly reduces yield loss and improves production efficiency [Applications] ◆ Flip Chip Underfill ◆ MEMS & HDD ◆ LED Phosphors in general (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: 170μm) ◆ Ag Paste ◆ UV Curing Resin Others

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