Ultra High Viscosity Compatible Jet Dispenser 【3300A】
Leave high-viscosity materials to us! A dispenser that expands dispensing possibilities.
Introducing the jet dispenser (QJC3300A) capable of handling a wide range of applications across various industries (semiconductors/LED post-processing/smartphone component assembly). It precisely applies high-viscosity materials that tend to become unstable. Additionally, it is equipped with micro-dispensing and speed capabilities, enhancing productivity. 【Features】 ◆ Dispensing capability of less than 0.001mg ◆ Achieves room temperature dispensing of high-viscosity materials using piezo technology → Reduces liquid splatter onto flip chips and substrates ◆ Realizes high-speed dispensing ◆ Achieves low running costs ◆ Simple software programming 【Applications】 ◆ Flip chip underfill / BGA underfill ◆ LED phosphors in general (SMD/side view/flip chip LEDs, etc.) ◆ Cream solder ◆ Ag paste ◆ Moisture-proof materials (conformal dispensing) ◆ UV-curable resins, etc. We offer free sample testing for those considering a purchase. For more details, please request documentation or refer to the catalog.
basic information
【Features】 ◆ Discharge capability of 0.001mg ◆ Realizes room temperature dispensing of high-viscosity materials using piezo technology → Reduces liquid splatter on flip chips and substrates (MAX: Capable of room temperature dispensing up to 200,000mPa.s) ◆ Achieves high-speed dispensing (compared to competitors: 1.5 to 2 times the processing capacity) ◆ Significantly reduces replacement time with a one-touch exchange method ◆ Achieves low running costs ◆ Simple software program We offer free sample testing for those considering a purchase. For details, please request materials or refer to the catalog.
Price information
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Delivery Time
Model number/Brand name
QJC3300A
Applications/Examples of results
【Wide-ranging achievements in various industries/materials】 ● Semiconductor back-end ● Underfill / Cream solder / Ag paste / UV curing resin, etc. ● LED back-end ● General phosphor dispensing (SMD/PLCC/Flip-chip LED, etc.) ● Substrate mounting ● Cream solder / Ag paste / Moisture-proof materials / UV curing resin / Hot melt, etc. ● HDD back-end ● Ag paste / Thermosetting resin, etc. ● MEMS ● Ag nano paste / UV nano paste, etc.
