Ultra-Precision Dispenser Quspa Series
Ultra-Precision Dispenser Quspa Series
New Common Sense in the Dispensing Industry Shinwa Ultra-Precision Dispenser 'Quspa' ● Semiconductor Backend Processes (Mainly Flip-chip Underfill) → Achieves high precision and high-speed processing! X-Y Repetition Accuracy: ±5μm → Reduction in the number of equipment investments due to increased speed → Improved stability of application volume through room temperature dispensing → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: 170μm) ◆ Ag Paste ◆ UV Curing Resin Others
1～4 item / All 4 items
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High - precision dispenser "Quspa" for high-speed micro dispensing
We propose a custom-made dispenser that fulfills your ideals.
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Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]
【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!
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Ultra-Precision dispensing Device MsL [Smartphone Component Assembly/Flip Chip]
Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!
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Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
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