Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin Others
basic information
Basic Information Precision Dispenser Device GP2 【*LED/Circuit Board Mounting Process】 【Features】 ◆ Device Size: 1,000mm × 1,000mm × 1,500mm ◆ Weight: Approximately 600kg ◆ Power Specifications: AC200V, 3-phase, 20A ◆ Ball Screw Drive (±30μm) ◆ Ultra-High Precision Image Processing System Chip Position Inspection Speed: 30 chips/sec ◆ Non-Contact Height Measurement Function (Laser Method) ◆ Target Work Size: MAX 250mm × 330mm MIN 50mm × 70mm ◆ Equipped with Jet Pump or Screw Pump ◎ Dispense Temperature Adjustment Unit Included ◆ Simple Software Program ◆ Simple Inspection Function (Coating Area/Coating Height Inspection with Feedback Function) Others ◆ Supports Three Languages: Japanese/English/Chinese ☆ We offer free sample testing for those considering a purchase ☆ ☆ For more details, please request materials or refer to the catalog ☆
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Model number/Brand name
GP2
Applications/Examples of results
【Wide-ranging achievements in various industries/materials】 ☆☆☆ Shinwa Dispenser ☆☆☆ Semiconductor back-end processes... Underfill/Dam & Fill Cream solder/Ag paste/UV curing resin, etc. LED back-end processes... General phosphor dispensing (SMD/PLCC/Dam & Fill, etc.) COB packages (5mg to 360mg) Board assembly... Cream solder/Ag paste/moisture-proof materials/UV curing resin, etc. HDD back-end processes... Ag paste/thermosetting resin/3D dispensing, etc. MEMS... Ag nano paste/UV nano paste, etc.
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Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Free sample testing currently in progress
Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp