Shinwa Co., Ltd. Mechatronics System Center Official site

Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin              Others

basic information

Basic Information Precision Dispenser Device GP2 【*LED/Circuit Board Mounting Process】 【Features】 ◆ Device Size: 1,000mm × 1,000mm × 1,500mm ◆ Weight: Approximately 600kg ◆ Power Specifications: AC200V, 3-phase, 20A ◆ Ball Screw Drive (±30μm) ◆ Ultra-High Precision Image Processing System Chip Position Inspection Speed: 30 chips/sec ◆ Non-Contact Height Measurement Function (Laser Method) ◆ Target Work Size: MAX 250mm × 330mm MIN 50mm × 70mm ◆ Equipped with Jet Pump or Screw Pump ◎ Dispense Temperature Adjustment Unit Included ◆ Simple Software Program ◆ Simple Inspection Function (Coating Area/Coating Height Inspection with Feedback Function) Others ◆ Supports Three Languages: Japanese/English/Chinese ☆ We offer free sample testing for those considering a purchase ☆ ☆ For more details, please request materials or refer to the catalog ☆

Price range

Delivery Time

Model number/Brand name

GP2

Applications/Examples of results

【Wide-ranging achievements in various industries/materials】 ☆☆☆ Shinwa Dispenser ☆☆☆ Semiconductor back-end processes... Underfill/Dam & Fill Cream solder/Ag paste/UV curing resin, etc. LED back-end processes... General phosphor dispensing (SMD/PLCC/Dam & Fill, etc.) COB packages (5mg to 360mg) Board assembly... Cream solder/Ag paste/moisture-proof materials/UV curing resin, etc. HDD back-end processes... Ag paste/thermosetting resin/3D dispensing, etc. MEMS... Ag nano paste/UV nano paste, etc.

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