Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]
【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!
☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.
basic information
【Features】 ◆Device size: 1,300mm × 1,100mm × 1,380mm ◆Weight: Approximately 800kg ◆Power specifications: AC200V, 3-phase, 20A ◆Ball screw drive (±10μm) ◆Ultra-high precision image processing system (±1μm) Chip position inspection speed: 30 chips/sec ◆Non-contact height measurement function (laser method) ◆Target work size: MAX 250mm × 330mm MIN 50mm × 70mm ※If you wish to change the size, please consult separately. ◆Equipped with jet pump or screw pump ◎Coating temperature control system ◎Syringe temperature control system ◎Nozzle heating unit ◆Substrate heating unit can be installed ◆Simple software program ◆Simple inspection function (Dispense weight measurement - feedback function) (Coating area/coating height inspection - feedback function) Others ◆Supports three languages: Japanese/English/Chinese ☆We offer free sample tests for those considering a purchase☆ ☆For details, please request materials or refer to the catalog☆
Price information
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Delivery Time
Model number/Brand name
Quspa-MsB
Applications/Examples of results
【Extensive Track Record in Various Industries/Materials】 Semiconductor Back-End Process ... Underfill/Dam & Fill Cream Solder/Ag Paste/UV Curing Resin, etc. LED Back-End Process ... General Phosphor Dispensing (SMD/PLCC/Dam & Fill, etc.) COB Packages (5mg to 360mg) PCB Assembly ... Cream Solder/Ag Paste/Moisture-Proof Materials/UV Curing Resin, etc. HDD Back-End Process ... Ag Paste/Thermosetting Resin/3D Dispensing, etc. MEMS ... Ag Nano Paste/UV Nano Paste, etc.
News about this product(2)
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Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Free sample testing currently in progress
Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Distributors
We manufacture and sell dispenser devices that achieve high-speed and high-precision micro-dispensing on a wide range of materials and substrates. With sales networks in 19 locations in Japan and 12 overseas, we propose dispensing solutions to be a closer presence for our customers.










