Sinwa Jet Pump (High Viscosity / High Speed Discharge / Ultra Micro) QJC3280F
World-class 0.001mg / Successful high-speed coating! Versatility in dispensing processes across various industries
【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin Others
basic information
【Features】 ◆ Achieves a dispensing capability of 0.001mg! ◆ Realizes room temperature dispensing of high-viscosity materials using piezo technology! → Reduces liquid splatter onto flip-chip/substrate side (MAX: Capable of room temperature dispensing up to 200,000mPa.s) ◆ Achieves high-speed dispensing ◆ Adopts a one-touch replacement method, significantly reducing replacement time! ◆ Realizes low running costs ◆ Simple software program We offer free sample testing for those considering a purchase. For details, please request materials or refer to the catalog.
Price information
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Model number/Brand name
QJC3280F
Applications/Examples of results
【Wide-ranging achievements in various industries/materials】 ■Semiconductor back-end processes Underfill/cream solder/Ag paste/UV curing resin, etc. ■LED back-end processes General phosphor dispensing(SMD/PLCC/Flip-chip LED, etc.) ■Board assembly Cream solder/Ag paste/moisture-proof materials/UV curing resin, etc. ■HDD back-end processes Ag paste/thermosetting resin, etc. ■MEMS Ag nano paste/UV nano paste, etc.
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News about this product（2）
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Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Free sample testing currently in progress
Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
