Vertical & Spin Leaf Lift-Off Device
Can also be used for organic peeling! Significant reduction in filter load can be achieved with cyclones and composite mesh.
The device is a dedicated single-wafer processing equipment designed to address various issues such as the re-adhesion contamination of a large amount of peeling metal debris generated during the lift-off process. In the peeling dip tank, a combination of downflow/QDR/spray/shower/side US/swing is used, while the cleaning and drying spin single-wafer chamber employs special nozzles/MS rinse/HP-Jet, achieving high-efficiency and uniform short-time lift-off without re-adhesion dirt, resulting in a high-purity substrate surface. 【Features】 ■ Usable for organic peeling as well ■ Significant reduction in filter load with cyclone and composite mesh ■ Over 10 years of delivery records with numerous units supplied to major electronic component manufacturers ■ This system can be replaced with the new "Spin/Dip type" or "UDS type" *For more details, please refer to the PDF materials or feel free to contact us. Wafer, single-wafer cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic cleaning equipment, cleaning equipment, resist, photoresist, wafer cleaning equipment, wafer cleaning machines, loaders, unloaders.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
