New Type UDS Spin Coater (Resist Stripping/Lift-Off System)

Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.

■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound 　◎Compatible with high-pressure jet and spray treatments 　◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out 　◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) 　◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate 　◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ 　　　　　　　　　　　　⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. 　◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.

Please also refer to the UDS spin processor for developing, etching, and cleaning processes.

basic information

【Other Features】 ■ Complete separation and prevention of chemical gas and mist in the lower processing section with a patented isolation plate. ■ Chemical and rinse treatment is possible on the back side of the substrate, ensuring it is contamination-free. ■ Shortening of the manufacturing process significantly increases production efficiency and can greatly reduce clean room occupancy area. 　◎ "One-pass processing" of etching and stripping is possible within the 1-system device. ■ Processing of ultra-thin and fragile substrates such as TAIKO substrates is also possible. ■ Please also refer to the UDS spin processor for etching, RCA cleaning, and developing systems. * For more details, please refer to the PDF document or feel free to contact us.