Spin wafer processing equipment (etching, RCA, cleaning, developing, etc.)
A spin sheet device that can obtain high-quality substrates at a low cost.
■ We recommend the latest model of the UDS spin processor. ◎ It is positioned as the "OLD" system within our company. ◎ Please refer to the new UDS spin processor and the new Spin Dip processor. ◎ All various elemental technologies related to spinning, such as mixing and rotational speed control, have been developed and applied to the new spin processor. ■ Optimal for RCA processing such as SPM, APM, HPM, and DHF. ■ Supports etching processes like ferric chloride and HF/HNO3. ■ Also compatible with lift-off resist stripping. ■ Can build a cost-effective system as a conventional flat Spin single wafer. ■ Ideal for the disposal of chemical waste. ■ Cross-contamination free. ◎ During SPM processing, mixing of new sulfuric acid and hydrogen peroxide is done directly above the substrate, eliminating the need for a heater. ◎ During APM processing, DIW is heated directly with water, and NH4OH and H2O2 are mixed in. ■ Optimal for processing Si, SiC, GaN, sapphire, GaAs, LT, etc. ■ Compatible with round substrates as well as square shapes like Cr masks. *For more details, please refer to the PDF document or feel free to contact us.
basic information
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