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Femtosecond laser processing machine (for industrial applications)
Support from contract processing and technical consulting to design proposals and delivery of mass production machines.
Composed of a laser light source compatible with three wavelengths and a high-precision processing machine, suitable for ultrashort pulse lasers (femtosecond lasers, picosecond lasers). Equipped with a femtosecond laser light source from Light Conversion. It allows for automatic switching between three wavelengths: UV, green, and 1μm. Burst mode option (G Hz + M Hz BiBurst). Precision micro-machining of high-hardness brittle materials for next-generation semiconductors such as SiC, GaN, and diamond is possible through cold ablation (non-thermal). We provide support from prototype processing on our demo machine to design proposals and delivery of mass production machines.
basic information
Maximum output 80 W, maximum pulse energy 2 mJ Three-wavelength support (UV/Green/IR) Burst mode option (G Hz + M Hz BiBurst) * For detailed specifications, please refer to our website.
Price information
Please contact us.
Delivery Time
Model number/Brand name
femt-pro
Applications/Examples of results
Combined with a full digital three-wavelength independent galvanometer scanner and an optical system with LCOS_SLM (spatial light modulator), it is possible to process high-hardness brittle materials for next-generation semiconductors such as SiC, GaN, and diamond, as well as to perform multi-point simultaneous processing and aberration correction on semiconductor substrates. Our laser processing trial service has received orders from over 10 companies, including major domestic semiconductor manufacturers and electronic component manufacturers.
