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UV lasers possess optical characteristics that enable vaporization processing through gasification ablation for both thermosensitive materials (resins) and high-hardness brittle materials, making them promising tools for precise marking regardless of the material, as well as for processing thermosensitive materials (resins) and high-hardness brittle materials. This characteristic aligns well with the processes required for the manufacturing of electronic components and semiconductor parts, leading to numerous inquiries at our lab regarding the development of methods for individual cutting of glass-epoxy substrates and processing ceramics, SiC, and diamonds. On the other hand, to efficiently implement processing for the aforementioned electronic components and semiconductor parts using UV lasers, high laser output is essential. We have developed a model that improves the laser oscillator output from the conventional product (5W nanosecond UV laser) to 25W. We have customized this high-output model for semiconductor equipment used in electronic substrate cutting devices, and we already have multiple units shipped. By expanding this achievement to a general-purpose model, we propose high-speed, high-precision fine laser processing tools in a cost-effective manner.

(Features) - High-power UV laser processing machine with scanning capabilities beyond markers - Sharpening processing using nanosecond UV short pulse high peak pulses - Applicable to high-hardness brittle materials and thermally fragile materials - High-speed processing with high-power laser + high-speed galvanometer scanner - High-contrast marking possible even over a wide range - Equipped with a renewed user interface (EZCAD3) - Ability to create dedicated processing recipes with SDK purchase - High harmonic crystal lifespan of 8,000 hours (with automatic crystal movement mechanism) - Selection of f-theta lenses tailored to applications (telecentric available) - Options for zoom beam expander and attenuator - Customization available for dedicated applications (Configuration) - 25W laser oscillator - Chiller - High-speed galvanometer mirror scanner - CAD software (PC not included) - Lifter (Customization for dedicated machines is also available. Please contact us for more information.)

Please contact us. We can offer proposals that balance cost performance with service and support for customers who are concerned about the high prices of major manufacturer products and the quality, service, and support issues associated with inexpensive Chinese products.

2 months (reference delivery time for standard configuration)

LMS-UV25W

- Resin sheet cutting and hole punching - Glass surface marking - Selective (partial) peeling processing of metal surface resin coating (layer) - 2D code marking - Scribing and hole punching of ceramic materials - Processing of high-hardness brittle semiconductor materials such as SiC and diamond