Thermomechanical Analysis / Thermal Expansion Rate Measurement Device Discovery TMA
Various measurement modes! High-sensitivity mechanical analysis is possible over a wide temperature range.
The thermal analysis device/thermomechanical measurement device "TMA Series" is designed to measure dimensional changes of samples under controlled temperature, time, stress, and atmosphere. It offers a variety of measurement modes, enabling the evaluation of material excessive properties (such as creep and stress relaxation) and the separation of overlapping thermal events (MTMA). This product is a research and development grade thermomechanical measurement device, equipped with high performance suitable for research, education, and quality control applications. 【Features】 ■ High sensitivity measurement ■ High versatility ■ Variety of measurement modes ■ Capable of measurements over a wide temperature range
basic information
- Non-contact, frictionless motors transmit loads from 0.001 to 2N, allowing for a wide range of sample measurements from soft compressible elastomers to hard composites. - A wide range of high-resolution measurement transducers achieve accurate dimensional change measurements with a resolution of 15nm over a sample length of up to 26mm and a measurement range of ±2.5mm. - Advanced test modes such as modulated (temperature modulated) TMA, dynamic TMA, creep, and stress relaxation extend functionality and provide users with even more valuable information about the mechanical behavior of materials. - The mechanical cooling accessory (MCA70) enables cooling control down to -70°C without the cost and hassle of liquid nitrogen. - Excellent TRIOS software. - A new innovative app-style touchscreen.
Price information
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Model number/Brand name
Discovery TMA
Applications/Examples of results
There is a growing demand for high-performance materials that meet the needs of applications with many challenges, and understanding the materials' responses to the environment is more important than ever. It conforms to industry standards for testing and provides information on the coefficient of thermal expansion (CTE), shrinkage, softening, and glass transition temperature of materials. Cutting-edge options allow for the acquisition of viscoelastic properties such as material stiffness (elastic modulus), damping characteristics (tanδ), creep, and stress relaxation.
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November Online LIVE Seminar! ~ Seminar on Moisture Absorption and Desorption Weight and Hygroscopic Property Evaluation ~
Event Date and Time: November 17, 2022 (Thursday) 13:00 - 14:00 (including Q&A) For details and registration, please use the button or link below! *Thank you for your participation!* 13:00 - 14:00 [Title] Is that malfunction caused by the resin? Understanding resin properties through material analysis under temperature and humidity control [Instructor] Yuki Kawada, Application Department, TA Instruments
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*Reception Closed* Online LIVE Seminar in October! ~Beyond 5G/6G Electronic Materials Seminar 2021~
We are pleased to welcome Mr. Hirobumi Matsumoto from Flexlink Technology Co., Ltd., who is active as a seminar lecturer on FPC technology (former Director and Fellow of Japan Mectron Co., Ltd.), to give a presentation on the latest trends in FPC material development for 5G/6G. Mr. Matsumoto's lecture will be available only via live streaming! There will be no archive distribution afterwards. Thank you for your understanding. Don't miss this valuable lecture! We will also introduce TA instruments and measurement examples that can assist in electronic materials research. We look forward to your participation. 【Participation Tool】Zoom *You can also participate via a web browser. (Participation is possible without downloading the Zoom application) Participation Fee: Free For details on the content and registration, please refer to the detailed page. We will notify you of the participation details via email one week before the event. Mr. Hirobumi Matsumoto, Flexlink Technology Co., Ltd. 【Title】Latest Trends in FPC Material Development for 5G/6G TA Instruments Application Division, Otsuka and Kawada 【Title】Measurement Devices and Examples for Thermal Expansion and Fatigue of Electronic Materials 【Title】Thermal Analysis Device for Measuring the Effects of Humidity
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*Application Closed* Hosted by the experts in thermal analysis and viscoelasticity! Free online seminar on January 15 - Re: Rheology -
★ T.A. Instrument ★ Announcement of the Online Live Seminar on Rheology We are pleased to announce an online seminar that will be held on January 15th, 2021. Due to the popularity of the online rheology seminar we held in May of this year, we have decided to hold it again. Feel free to participate from your home or workplace. ● Date and Time: January 15, 2021 (Friday) 13:30 - ● Participation Fee: Free ● Participation Tool: Zoom (planned) Please check the following URL for details. https://reg34.smp.ne.jp/regist/is?SMPFORM=mis-lfleke-2c81dbc799c7197ea97011c8ea76861c
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*Application Closed* Hosted by experts in thermal analysis and viscoelasticity! Free online seminar on January 14 - Re: Thermal Analysis -
★ T.A. Instrument ★ Announcement of Online LIVE Seminar on Thermal Analysis We are pleased to announce an online seminar on thermal analysis to be held on January 14, 2021. Due to the popularity of the online thermal analysis seminar held in May of this year, we have decided to hold it again. Feel free to join from your home or workplace. ● Date and Time: January 14, 2021 (Thursday) 13:30～ ● Participation Fee: Free ● Participation Tool: Zoom (planned) For more details, please check the URL below. https://reg34.smp.ne.jp/regist/is?SMPFORM=mis-lflekc-8380f8032a474c74b8886788de350993
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*Application Closed* Hosted by experts in thermal analysis and viscoelasticity! Free online seminar on November 25 - Battery LIVE Season 3 -
