Announcement of the completion and start of orders for the "TY-VISION A308DC," a final appearance inspection device for circuit boards that enhances defect detection capabilities in package substrates.
太洋テクノレックス 本社 和歌山
We are advancing the development of the high-performance appearance inspection device "TY-VISION," and we are pleased to announce the completion of the appearance inspection device "TY-VISION A308DC," which further enhances the detection of fine defects. ● Optical resolution: 3µm ● Improved detection capability for high-resolution substrates (package substrates, module substrates) ● Achieves high focus accuracy with auto-calibration features (auto-focus function, smoothness adjustment mechanism) ● [Multi-scan function] For double-sided inspection: 2 scans per side × front and back; for single-sided inspection: 4 scans per side ● Designed with consideration for operation in clean rooms
