[TAIYO] Announcement of the release of the appearance inspection device 'TY-VISION M111SC' with enhanced detection of fine defects, featuring an optical resolution of 2.5μm (continued).

太洋テクノレックス本社　和歌山

We are advancing the development of high-performance for our appearance inspection system "TY-VISION series," and we are pleased to announce the completion of the appearance inspection device "TY-VISION M111SC," which is equipped with an optical system featuring an optical resolution of 2.5μm. In recent years, the semiconductor market has continued to thrive against the backdrop of further expansion of DX and IoT, the spread of 5G communication networks, the advancement of digitalization in society, and the transformation of the automotive industry with the progress of autonomous driving and electrification. The quality levels of various substrates have been rising, especially for high-definition substrates, prompting us to develop the "TY-VISION M111SC" to meet market demands. Please refer to the attached file for more details. *This is the press release, and we would like to inform you that it has been featured in the only specialized magazine in the printed circuit board industry, "Printed Circuit Journal." (We have received consent for the publication in the magazine.)

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2.5μm substrate final appearance inspection device TY-VISION M111SC
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