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The A300 series, suitable for package and module type boards, finally includes a 2.5µm specification model! 【TY-VISION A308DC】

Fully Automatic PCB Final Appearance Inspection Device 'TY-VISION A308DC' ■ Optical resolution: 3μm/5µm (2.5μm) ■ Maximum substrate size is 200mm × 300mm.

Ideal for visual inspection of ceramic substrates and power semiconductors! TY-VISION M109SC has a proven track record in detecting cracks, discoloration, and chipping!

【Specifications】 ■ Board size (mm): up to 305×510 ■ Board thickness (mm): 0.1 to 2.4 ■ Camera type: Color line sensor camera (7.3K or 16K) ■ Camera angle: 3-stage switchable ■ Resolution: 5μm / 10μm (fixed at shipment) ■ Light source: White LED (adjustable light intensity for each entry) ■ Power supply: AC 200–230V ±10% single phase 50/60 15A ■ Device size (mm): 1131(W)×1430(D)×1542(H) (main unit during operation) *For more details, please refer to the PDF document or feel free to contact us.

Would you like to inspect those fine defects with TY-VISION? The M111SC detects defects of about 10μm with an optical resolution of 2.5μm!

■High-resolution specifications / Optical resolution: 2.5μm / 3μm (fixed at the time of manufacture) ■Standard equipped with FFU (Fan Filter Unit) ■Equipped with various focusing adjustment mechanisms ■Refined imaging unit and transport unit 〇Target substrate: Rigid substrates (single-sided, double-sided, multilayer) / Ceramics, etc. 〇Target substrate size: Up to 200 (W) × 300 (L) mm 〇Target substrate thickness: Up to 2.0 mm 〇Optical resolution: 2.5μm / 3μm / 5μm

High resolution, high functionality, high detection! The desired features are condensed into a specification adapted for package substrates, allowing for detailed settings to match the inspection standards of various companies!

**Product Specifications (Excerpt)** ■ Model: A307DC ■ Board Size (mm): 45×50 to 200×300 ■ Board Thickness (mm): 0.2 to 2.0 ■ Camera Type: 16,000 Pixel Color Line Sensor Camera ■ Camera Angle: Switchable in 3 Stages ■ Resolution: 5μm / 10μm (Standard) ■ Light Source: White LED (Adjustable Light Intensity for Each Entry) ■ Power Supply: AC 200/208/220/230V ±10% Three-phase 50/60 Hz 30A ■ Device Size (mm): 2248(W)×1687(D)×1987(H) (Operational) *For more details, please refer to the PDF document or feel free to contact us.*

Attention companies struggling with final appearance inspection of PCBs! The solution to your problem is "TY-VISION XAIS"! 【Final PCB Appearance + AI System】

【Equipment Configuration and Inspection Flow at the Time of XAIS Introduction】 1. AVI - Conduct inspections using pre-created inspection data - Send information about detected defects to XAIS 2. XAIS - Automatically categorize defects detected by AVI into "Good (PASS)" and "Needs Verification (VERIFY)" - Only the information marked as "Needs Verification (VERIFY)" is sent to VERIFY 3. VERIFY - Inspectors verify only the locations marked as "Needs Verification (VERIFY)" received from XAIS and make the final judgment

Pioneer of cylindrical mirror polishing machines! Introducing the Mirak (Taiyo Kogyo Group) equipment. (Cylindrical mirror grinding machine, mirror finishing, buff polishing, grinding wheel)

Since its establishment, Mirak Corporation (a subsidiary of Taiyo Kogyo Group) has delivered over 500 units to companies both domestically and internationally, demonstrating durability and practicality through long-term use. This cylindrical mirror polishing machine is a newly developed polishing machine created by our top technical team, leveraging our years of expertise in ultra-mirror finishing and the cooperation of user know-how from various companies. Unlike conventional polishing methods, this machine is composed of a robust main body and grinding stone head, adopting our unique idea mechanism, which allows for pressure adjustment and fixed grinding methods, enabling it to handle everything from heavy grinding to ultra-mirror grinding. Additionally, this machine can achieve mirror polishing by simply changing the grinding stone, regardless of the material used. It can achieve a surface roughness (Cr) Rmax of 0.05μm. Unlike traditional polishing methods, it offers astonishing grinding power without edge wear, significantly reducing polishing time for final finishing purposes. It can eliminate grinding marks after lathe machining or grinding machine processing and enhance surface roughness, making it suitable for various applications. *Please consider the working environment (clean room), water quality (1µm filter), etc., for ultra-mirror finishing. *For more details, please contact us.