Improvement of molding technology for high-density wiring in flexible printed circuit boards (FPC).
太洋テクノレックス 本社 和歌山
Improvement of High-Density Wiring Molding Technology Our company has been able to enhance the molding technology for high-density wiring in our core business, the electronic substrate business. As we announced in our notice dated March 6, 2023, regarding capital investment in the electronic substrate business, we have introduced production equipment to respond to the improvement of technology and the increasing demand for product commercialization.
