◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.

With Taiyo Techno Rex's FPC short delivery service, you can smoothly transition to high-quality mass production. From prototyping to mass production, everything is managed in one place! ■ Reliable track record ■ One-stop service ■ Flexible response capability ■ Short delivery times, high quality, and the latest technology

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard