High-frequency compatible FPC
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction
basic information
We are engaged in product development using various materials, including fluorine composite materials, MPI, and LCP. Collaboration for joint launches is also possible. We hope you will consider this.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
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Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
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Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.
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【TTL】Short delivery time! High quality! Express delivery of flexible printed circuit boards (FPC)! For arrangements of "flexible printed wiring boards" with a short delivery time, be sure to check Taiyo Technorex!
With Taiyo Techno Rex's FPC short delivery service, you can smoothly transition to high-quality mass production. From prototyping to mass production, everything is managed in one place! ■ Reliable track record ■ One-stop service ■ Flexible response capability ■ Short delivery times, high quality, and the latest technology
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【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*