Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
Taiyo Industry supports everything from prototyping to mass production. ■ Achieves high density through pad-on-bead technology. ■ Compatible with 400μm pitch BGA. ■ Improved design flexibility with multilayer structures for high-density wiring. ■ Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance
basic information
For more details, please refer to the PDF document or feel free to contact us.
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Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
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Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.
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【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard
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Until FPC is completed... The manufacturing process of Taiyo Technorex has been documented.
This is a very popular document. It provides a clear explanation of the general manufacturing process of FPC at our company, incorporating animation. Please take a look. 【Business Overview】 ■ Electronic Circuit Board Business - Design and production of flexible printed circuit boards - Assembly of printed circuit boards, etc. ■ Test System Business - Development and manufacturing of circuit board power-on inspection systems - Development and manufacturing of final appearance inspection systems for circuit boards, etc. ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems, etc. ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines, etc.
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【TAIYO】Corporate Ranking Overall 4th! "Full support from FPC design, prototyping, and mass production to board electrical testing, appearance inspection systems, and FA automation! TAIYO FPC SOLUTIONS!"
【Aggregation Period】April 5, 2023 - April 11, 2023 ★Company Ranking (Out of a total of 44,072 points)  ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ 4th Place: Taiyo Kogyo Co., Ltd. Wakayama 【Thank You】 Thank you very much for the many accesses. 【Company Overview】 Taiyo Kogyo Co., Ltd. operates in the fields of prototype development of flexible printed circuit boards (FPC) and the manufacturing of circuit board inspection equipment. FPCs are fundamentally related to the structure of hardware, requiring both high precision quality and shortened development periods. On the other hand, the circuit board inspection systems mainly include electrical inspection systems and final appearance inspection systems, which are also adopted in the mass production sites of FPCs and package/module type circuit boards. 【Business Activities】 ■ Electronic Circuit Board Business - Design and manufacturing of flexible printed circuit boards - Printed circuit board assembly and other services ■ Test System Business - Development and manufacturing of circuit board electrical inspection systems - Development and manufacturing of final appearance inspection systems and other services ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems and other services ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines and other services
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*