Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)
From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!
We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating the various characteristics of new materials that are being improved daily.
basic information
- CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measurement of test samples and report submission
Price range
Delivery Time
Applications/Examples of results
Evaluation tests for new substrate materials from substrate manufacturers, etc.
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【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
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【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard
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【TAIYO】Material Evaluation Services FPC・MPI・PTFE (Flexible Substrates) From high-frequency applications to various characteristics, we provide design, manufacturing, evaluation testing, and analysis reports for flexible printed circuit boards!
We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating various characteristics of new materials that are being improved daily.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*