[Exhibition Report] We exhibited at NEPCON Japan 2025!
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
basic information
* Flexible Printed Circuit Board * FA and Automation * Final Appearance Inspection System For more details, please contact us at the information below. Taiyo Techno Rex will respond to various inquiries from our customers. Contact Information: Head Office Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690
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Applications/Examples of results
Please leave the FPC design, prototype, small to medium lot production, and implementation to us. We propose systems suitable for final appearance inspection of high-precision substrates, ceramics, and more, utilizing material handling and collaborative robots for FA and automation. For detailed information such as photos of the exhibition venue and exhibits, please refer to the catalog "Exhibition Report_Electro Test Japan 2025." https://pr.mono.ipros.com/taiyo-kougyo/catalog/
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[Press Release from Taiyo Techno Rex] Announcement regarding the launch of electronic device contract manufacturing services.
We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.
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【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*