[Exhibition Report] We exhibited at NEPCON Japan 2025!
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ ~ Touch, Compare, Experience FPC! ~ ● Comparison of weight between rigid boards and FPC ● Reduction of board area through high-density wiring ● Difference in heat generation temperature due to copper thickness ● Improved work efficiency with transparent FPC, etc. ~ Technology Topics ~ ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ By achieving teaching-less implementation through visual feedback control, eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ TY-VISION XAIS AI-based defect detection and false report reduction ・M111SC (manual machine) high-definition (package) board × high-resolution inspection ・M109SC (manual machine) diverse workpieces × large format
basic information
* Flexible Printed Circuit Board * FA and Automation * Final Appearance Inspection System For more details, please contact us at the information below. Taiyo Techno Rex will respond to various inquiries from our customers. Contact Information: Head Office Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690
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Applications/Examples of results
Please leave the FPC design, prototype, small to medium lot production, and implementation to us. We propose systems suitable for final appearance inspection of high-precision substrates, ceramics, and more, utilizing material handling and collaborative robots for FA and automation. For detailed information such as photos of the exhibition venue and exhibits, please refer to the catalog "Exhibition Report_Electro Test Japan 2025." https://pr.mono.ipros.com/taiyo-kougyo/catalog/
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*