[Exhibition Report] We exhibited at JPCAshow 2025!
I would like to briefly introduce the successful exhibition content of FPC.
◎Introducing Our Company's "Strengths" in the Processing Engineering >> There are multiple important processing steps in FPC manufacturing. Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. We have introduced the "strengths" we have cultivated over many years in each process: <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Processing> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision contour processing ±50μm, a variety of tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing >> Normally, there are no opportunities to see anything other than the finished product, but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. *Through-hole drilling, exposure/development, etching, contour processing, etc.
basic information
* Flexible Printed Circuit Board * FA (Factory Automation) * Final Appearance Inspection System For more details, please contact us at the information below. Taiyo Techno-Rex responds to various inquiries from customers. Contact Information: Head Office Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690
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Please leave the FPC design, prototype production, small to medium lot mass production, and implementation to us. We propose systems suitable for final appearance inspection of high-precision substrates, ceramics, and more, utilizing material handling and collaborative robots for FA and automation. For detailed information such as photos of the exhibition venue and exhibits, please refer to the catalog "Exhibition Report_JPCAshow2025." https://pr.mono.ipros.com/taiyo-kougyo/catalog/
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[Press Release from Taiyo Techno Rex] Announcement regarding the launch of electronic device contract manufacturing services.
We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.
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[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*