Dual Side Flying Probe Tester: APT-1600FD
This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.
Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in its category. By using the flying probes on both the top and bottom simultaneously, a combination inspection with up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★ You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing ★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.
basic information
To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.
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Applications/Examples of results
【Adopted Industries】 EMS, EMDS companies Semiconductor manufacturing equipment Communication infrastructure and servers Automotive, aircraft, and marine Medical devices Industrial machinery and robots FA machine tools Power generation and power systems 【Use Cases】 ■ Inspection of mass-produced items Connected to loaders/unloaders for automated/unmanned inspection even in large lots ■ Inspection of multi-variety small quantity substrates No need for dedicated jig manufacturing costs; easy identification of defective areas ■ Inspection of prototype substrates Function tests responsive to design changes (applying voltage to the substrate to confirm circuit operation (ON/OFF) and measure direct current) ■ Implementation confirmation inspection during model switching Verification of the mounting program for the first lot and checking for set errors during model switching ■ Defect analysis inspection Inspection of substrates that failed functional tests and defect analysis of substrates that failed in the market We have a proven track record of being utilized in various other applications as well. For more details, please contact your sales representative.
Detailed information
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Line up（4）
| Model number | overview |
|---|---|
| APT-1600FD | Dual-side inspection compatible machine |
| APT-1600FD-A | Dual-side inspection compatible, inline machine (model with automatic transport conveyor) |
| APT-1600FD-SL | Dual-side inspection, large board compatible machine |
| APT-1600FD-SL-A | Dual-side inspection, large board compatible, inline machine |
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News about this product（30）
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The global site for the flying probe tester has been renewed.
Please see the TAKAYA Flying Probe Tester page from the related links below. Takaya Corporation has entered into a dealership agreement with Itochu Corporation for overseas sales, establishing sales/service bases for flying probe testers in the United States, Europe, China, and Southeast Asia, with numerous sales achievements in over 46 countries. We will continue to regularly provide information on agents in various countries and details about our participation in overseas exhibitions. You can also rely on us for the introduction and local setup of flying probe testers at overseas bases.
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I received the Excellent Award at the 38th Electronics Packaging Society Spring Conference.
From March 13 (Wednesday) to 15 (Friday), 2024, at the "38th Spring Conference of the Electronics Packaging Society" held at Tokyo University of Science, Takaya Corporation presented a lecture titled "Latest Trends in Hybrid Testing Systems Combining JTAG Inspection and Flying Probe Testers," which received the Excellence Award at the conference. On September 12, 2024, a ceremony was held at Daido University in Aichi Prefecture during the "MES2024 Symposium," where we were presented with a commemorative plaque.
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I was interviewed by "The Window of the Circuit Board."
From July 12 to 14, 2024, Takaya Corporation's Industrial Equipment Division exhibited at the "Electronic Equipment Total Solution Exhibition 2024 (JPCA Show 2024)" held at Tokyo Big Sight. During the event, we were interviewed by the PCB information site "Kiban no Madoguchi," and the footage has been published on the Kiban no Madoguchi YouTube channel. Please take a look!
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MES2024 34th Microelectronics Symposium Exhibition Booth Participation Information
Takaya Corporation will exhibit a corporate booth at the "MES024 34th Microelectronics Symposium," which will be held from September 11 (Wednesday) to 13 (Friday), 2024, at the Daido University Takiharu Campus in Minami Ward, Nagoya City. When you visit the symposium, please be sure to stop by Takaya's booth. Organizing Office (The Japan Society of Electronics Packaging) 167-0042 Tokyo, Suginami Ward, Nishiogikita 3-12-2 TEL: 03-5310-2010 For details and the latest information, please refer to the related materials flyer and the MES2024 website.
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Report on Accelerating Inspection of Flying Probe Testers Using Deep Reinforcement Learning [Joint Research with Ehime University]
Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on "Accelerating Inspection of Flying Probe Testers Using Deep Reinforcement Learning." Recently, from June 12 (Wednesday) to June 14 (Friday), 2024, at the Tokyo Big Sight, during the exhibition "JPCA Show 2024 / 2024 Microelectronics Show," a report on this research was displayed and introduced at the Ehime University booth. Additionally, on June 14 (Friday), a seminar presentation regarding this topic was held at the venue. For those who were unable to attend, we will also publish the report on this research on this page. It can be accessed from the related catalog pages below. We encourage everyone to take this opportunity to take a look.
