High-precision multi-die bonder flip chip bonder
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
The "FALCON Series" is a die flip chip die bonder that offers a lineup of devices tailored to user needs, ranging from manual to automatic specifications. We can manufacture die flip chip bonders according to your company's required specifications by combining various options. We can propose devices suitable for your specifications, including heating mechanisms, high-load bonding, wafer pickup, and chip flipping functions. Additionally, there are higher models that can accommodate fully automatic specifications with attachments like conveyors, and since these are our own products, we can flexibly respond to your desired customization specifications. 【Features】 ■ Operability Achieves smooth XY stage operability using a joystick. Basic operations can be completed easily with the joystick, providing simple operation specifications. ■ Load Control Supports applications requiring advanced load control through program operation by a motor (Z-axis resolution in micrometers) and VCM control (optional). ■ Software User interface design that does not require a manual. User-friendly specifications that allow for easy setting of bonding parameters and recognition program creation. *For more details, please download the PDF materials.
basic information
■Image Recognition Programs for setting movement distance and corrections can be easily configured. With the recognition program, it is possible to recognize substrates and chips, and to mount chips according to various setting parameters, thereby maintaining consistent mounting accuracy under the same conditions. It is also possible to accommodate coating/chip mounting inspection, character recognition, and wafer mapping functions according to mounting options. ■Customization Customization design support tailored to your company's specifications. ■Wide Range of Applications Supported by Abundant Options Various heater stages (pulse/constant) / N2 purge mechanism / ultrasonic bonding / dispensers / VCM pressurization units / stamping units / chip flipping mechanisms / wafer lifting mechanisms / customized substrate holders / chip tray holders / magazine transport, and various options tailored to your specifications. 【Examples of Supported Applications】 Die attach, flip chip, 3D mounting, MEMS, MOEMS, optical devices, VCSEL, paste bonding, eutectic bonding (AuAu), and mounting of various high-precision components, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
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Model number/Brand name
FALCON series
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
