High-precision multi-die bonder flip chip bonder

Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]

last updated Sep 19, 2025

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

last updated Oct 01, 2025

Aluminum wire bonder/ribbon bonder ASTERION

"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.

last updated Sep 19, 2025

Aluminum wire/ribbon wire compatible wedge bonder PowerFusion

Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.

last updated Sep 19, 2025

X-ray inspection device (multi-focus X-ray transmission and CT system)

An X-ray fluoroscopy and CT device that combines world-class resolution with user-friendly operability, capable of supporting various applications.

last updated Sep 19, 2025

Battery bonding dedicated wire bonder "Asterion-EV"

Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.

last updated Sep 19, 2025