Tabletop Semi-Automatic Die Bonder Flip Chip Bonder
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.
basic information
The XY table features a lineup based on the operation and drive method of the Z-axis (head). - Full manual type (all XYZ axes operated manually) Model: T-4909 : T-5100 : T-5100-W (model equipped with a wafer table lifting mechanism) - Manual type (XY stage manual, Z-axis motor controlled) Model: T-5300 : T-5300-W (model equipped with a wafer table lifting mechanism) - High load bonding type (maximum 100kg, Z-axis motor controlled) Model: T-5000 For more details, please refer to the catalog.
Price information
It varies by model and options. Please contact us.
Delivery Time
Model number/Brand name
Dr. Tresky's die bonder / flip chip bonder
Applications/Examples of results
DaiBond, chip sorting, MEMS, MOEMS, VCSEL, RFID, paste bonding, flip chip mounting, eutectic bonding (AuAu), 3D mounting, optical communication devices, handling of LD arrays, direct pickup and mounting from wafers.
Detailed information
-
T-4909-AE A fully manual model that enables easy mounting of chips and fine components for anyone, thanks to its simple operability. Equipped with a load detection sensor, it allows for the creation of process parameters on the main panel, making it suitable for a wide range of applications such as small-batch/multiple-product production and research and development.
-
T-5100/T-5100-W A full manual die bonder that achieves simple operability and excellent option expandability. Process parameter settings and load monitoring via a touch panel screen.
-
T-5300/T-5300-W - The head is motor-controlled, achieving precise bonding load control. - Equipped with software that allows setting and registering bonding parameters via a touch panel. - Programmable (load, time, speed, heater heating/cooling temperature rise/cooling (optional), etc.) - Load control specifications: 20 to 4,000g.
-
T-5500 - High bonding load compatible model (maximum 50kg) with motor-controlled head. - Equipped with software that allows setting and registering bonding parameters via a touch panel. - Load control specifications: Standard specification: 20g to 4,000g, HF module specification: 4 to 100kg.
Related Videos
catalog（3）
Download All Catalogs
Recommended products
Distributors
Our mission at Techno Alpha is to "shine a light on Japanese manufacturing" by creating overwhelming added value. To achieve this, we have set our vision as "the best technology trading company in Japan" and are committed to realizing it. Techno Alpha is a team composed of members with technical backgrounds, including sales, service, mechanical design, electrical design, and software development. Our strength lies in our ability to solve problems from the same perspective and in the same language as our customers, enabling us to provide rapid access to the latest technologies. In this team, we strive to discover cutting-edge technologies from around the world, introduce them domestically, and develop what does not yet exist in the market ourselves. By quickly uncovering the world's leading technologies and developing what is not available, we can support the entire manufacturing industry in Japan. Our team upholds the value of "connecting with the world, honing our technology, and challenging the future," and we will continue to refine our ability to discover products, design and develop, and provide technical services, all in pursuit of creating overwhelming added value that will impress our customers.