Tabletop Semi-Automatic Die Bonder Flip Chip Bonder
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.
basic information
The XY table features a lineup based on the operation and drive method of the Z-axis (head). - Full manual type (all XYZ axes operated manually) Model: T-4909 : T-5100 : T-5100-W (model equipped with a wafer table lifting mechanism) - Manual type (XY stage manual, Z-axis motor controlled) Model: T-5300 : T-5300-W (model equipped with a wafer table lifting mechanism) - High load bonding type (maximum 100kg, Z-axis motor controlled) Model: T-5000 For more details, please refer to the catalog.
Price information
It varies by model and options. Please contact us.
Delivery Time
Model number/Brand name
Dr. Tresky's die bonder / flip chip bonder
Applications/Examples of results
DaiBond, chip sorting, MEMS, MOEMS, VCSEL, RFID, paste bonding, flip chip mounting, eutectic bonding (AuAu), 3D mounting, optical communication devices, handling of LD arrays, direct pickup and mounting from wafers.
Detailed information
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T-5100/T-5100-W A full manual die bonder that achieves simple operability and excellent option expandability. Process parameter settings and load monitoring via a touch panel screen.
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T-5300/T-5300-W - The head is motor-controlled, achieving precise bonding load control. - Equipped with software that allows setting and registering bonding parameters via a touch panel. - Programmable (load, time, speed, heater heating/cooling temperature rise/cooling (optional), etc.) - Load control specifications: 20 to 4,000g.
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T-5500 - High bonding load compatible model (maximum 50kg) with motor-controlled head. - Equipped with software that allows setting and registering bonding parameters via a touch panel. - Load control specifications: Standard specification: 20g to 4,000g, HF module specification: 4 to 100kg.
