Lead-free solder / low melting point solder / molding solder

Molding solder for semiconductor devices and microelectronics.

last updated Sep 19, 2025

STAYSTIK thermoplastic adhesive

Outgassing levels are extremely low! The perfect adhesive for improving reliability.

last updated Sep 19, 2025

Techno Alpha's "Reflow Oven"

We handle a variety of reflow devices that can achieve stable temperature processes.

last updated Sep 19, 2025

VPS Reflow Device

Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!

last updated Sep 19, 2025

Model 5100 Vacuum and Pressure Reflow Device

Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.

last updated Sep 19, 2025

Model 1200 Vacuum and Pressure Reflow Device

The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.

last updated Sep 19, 2025

High thermal conductivity adhesive / die attach paste ATROX series

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

last updated Sep 19, 2025