Soldering-related
Soldering-related
This is a product related to soldering processes such as reflow.
1~15 item / All 15 items
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Temperature logger for localized jet soldering (selective soldering) furnace.
A logger system optimal for measuring product temperature, jet solder, and ambient temperature in a selective soldering furnace.
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Bond Tester SigmaLite
Basic model bond tester Sigma Lite, ideal for wire pull tests and shear tests.
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Lead-free solder / low melting point solder / molding solder
Molding solder for semiconductor devices and microelectronics.
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STAYSTIK thermoplastic adhesive
Outgassing levels are extremely low! The perfect adhesive for improving reliability.
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Techno Alpha's "Reflow Oven"
We handle a variety of reflow devices that can achieve stable temperature processes.
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VPS Reflow Device
Achieve a stable temperature process! Capable of 3D implementation and accommodating three-dimensional structures!
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Model 5100 Vacuum and Pressure Reflow Device
Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.
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Model 1200 Vacuum and Pressure Reflow Device
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
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1000kgf share strength compatible Sigma HF (renewed version)
Ultrasonic metal-joined power module terminals and busbars, maximum 1000 kgf shear measurement compatible model for large area die shear strength testing.
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Sigma, the ideal bond tester for strength testing of bonding wires.
Equipped with various load cells on a rotary head, there is no need for operators to replace the load cells! Ideal for quality control and condition setting of various bonding wires.
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Netherlands XYZTEC Bond Tester Sigma (Joint Strength Testing Machine)
The latest model Sigma meets a wide range of bonding strength measurement needs with just one unit, leading the global market.
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Reflow Temperature Logger System
A logger system suitable for temperature measurement of printed circuit boards and electronic components during reflow. Compatible with temperature measurement in a vacuum reflow oven.
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High thermal conductivity adhesive / die attach paste ATROX series
Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.
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Atmospheric Pressure Plasma Device Plasma Beam RT
We provide optimal solutions for high-speed, high-efficiency, and extensive inline plasma processing of two-dimensional surfaces.
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Atmospheric Pressure Plasma Device Plasma Beam
Atmospheric pressure plasma device using compressed air - Low running costs - High surface modification effect through spot treatment
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