High thermal conductivity adhesive / die attach paste ATROX series
Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.
This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.
basic information
**Features** - High thermal conductivity (higher than typical solder); 70-200 W/m·K. - High adhesion strength to metal lead frame/substrate-based packages using metal dies or bare Si dies, thanks to a unique resin system. - Reliable performance compliant with MSL1 standards. - Ideal for application using large and small needle nozzles or showerhead nozzles. - Minimizes voids in large die packages. - Improved workability for high-density mounting due to no dry-out (long staging time <48 hours). - Adhesion is possible without pressure. - No resin bleed-out, making application easy.
Price information
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Delivery Time
Model number/Brand name
Macdermid's ATROX paste
Applications/Examples of results
We have a track record of adoption by domestic and overseas semiconductor manufacturers. 【Package Examples】 QFN SO TO TSSO LGA QFP
