Model 1200 Vacuum and Pressure Reflow Device
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
SST is a global leader providing solutions and equipment for microelectronics assembly processes. We perform high-precision pressure management, including pressurization with vacuum and process gases, and offer solutions for processes such as voidless soldering, brazing, glass sealing, high-density sealing, moisture getter activation treatment, and wafer bonding.
basic information
"Industry-leading" compact and high-performance tabletop vacuum/pressure reflow system. The Model 1200 from SST Vacuum Reflow Systems is an ideal device for process development and small-scale production of fluxless and voidless soldering for microelectronics packages and electronic components. It offers simple operability and flexible profile creation. Automatic process control is possible with temperature control linked to a sequencer.
Price range
P5
Delivery Time
OTHER
Model number/Brand name
Model 1200
Applications/Examples of results
Automotive components High-frequency package Microwave package CPV solar cell module Crystal oscillator Fiber optics MMIC Flip chip Oscillator GaN MMIC Pacemaker Amplifier for hearing aids Power module Hermetic electrode glass sealing Pressure sensor Implantable medical devices Communication equipment Laser diode (LD) RF devices LED
Detailed information
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Model 5100 is a vacuum/pressure reflow device with a large chamber size/processing area, making it an optimal device for mass production of microelectronics packages.
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The Model 3130 vacuum reflow device is ideal for mass production of microelectronics packages such as vacuum solder reflow, glass sealing, and eutectic bonding, with heating up to 500°C (optionally up to 1000°C).
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Model 518 vacuum/pressure reflow is an ideal device for economical process development and the production of small-batch, diverse microelectronics packages.
Line up（3）
| Model number | overview |
|---|---|
| Model 5100 | Model 5100 is a vacuum/pressure reflow device with a large chamber size/processing area, making it the optimal equipment for mass production of microelectronics packages. |
| Model 3130 | The Model 3130 vacuum reflow device is ideal for mass production of microelectronics packages such as vacuum solder reflow, glass sealing, and eutectic bonding, with heating up to 500°C (optionally up to 1000°C). |
| Model 518 | The Model 518 vacuum/pressure reflow is the optimal equipment for economical process development and production of small quantities of diverse microelectronics packages. |
