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STAYSTIK thermoplastic adhesive

Outgassing levels are extremely low! The perfect adhesive for improving reliability.

Thermoplastic resins have the property of softening when heated to a specified temperature and then hardening when the temperature decreases. STAYSTIK adhesive is an adhesive that utilizes this characteristic of thermoplastic resins. Since no curing accelerators are added like in thermosetting adhesives, it is physically stable and allows for long-term storage at room temperature. Additionally, it softens upon heating, making rework after adhesion easy. 【Features】 - Extremely low outgassing levels - Reworkable (can be peeled off with solvents or heat) - Can be stored at room temperature for one year - Available in two types: paste type and film type - Three types: conductive, thermal conductive (electrically insulating), and insulating - The paste has minimal "bleeding" during curing (heating) - The film type and paste can be bonded with short-term (seconds to minutes) heat pressing after B-stage - High reliability conforming to military standard MIL-STD-883, 5011/2 - Stress relief achieved with low elastic modulus - Compliant with RoHS directive - PFAS-free

Related Link - http://www.technoalpha.co.jp/products/board/stayst…

basic information

This adhesive is very helpful in improving yield and quality by switching to thermoplastic adhesives such as film types and wafer backcoat types. It has a proven track record and is well-received by many customers. - Three types: conductive with silver filler, insulating without filler, and thermally conductive containing aluminum nitride (electrically insulating). - Due to its high viscosity, it maintains its shape to some extent even after dispensing. - Can be stored for one year after manufacturing at room temperature.

Price information

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Delivery Time

Please contact us for details

If we have stock available, delivery can be made within as short as 5 days.

Model number/Brand name

STAYSTIK

Applications/Examples of results

Adhesion of large, thinned dies, quartz oscillators, chips in SAW devices and optical communication devices, adhesion of elements in LED print heads (die bonding), heat sinks, and heat spreaders.

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