Model 5100 Vacuum and Pressure Reflow Device

Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.

The "Model 5100" is a batch-type vacuum pressure reflow device manufactured by SST Vacuum Reflow Systems. It allows for automatic control of heating and cooling settings with high precision. The uniquely designed IR heater uniformly heats the entire process area while providing temperature feedback control in the process area. It is suitable for mass production of flux-free and void-free soldering for microelectronics packages and electronic components. Additionally, it has a proven track record in glass-metal bonding for RF power devices, crystal devices, image sensors, and in hermetic sealing, vacuum sealing, and lid sealing using eutectic bonding for aerospace and high-end industries. 【Features】 ■ Achieves flux-free and void-free soldering ■ Maximum temperature of 500℃ ■ Vacuum level of 10-5 torr (10-3 Pa) ■ Maximum chamber pressure level of 40 psig (3.7 bar, 0.37 MPa) ■ Realizes precise heating and cooling control ■ Equipped with a system that can optimally control temperature, vacuum, and pressure *For more details, please refer to the PDF materials or feel free to contact us.

basic information

【Specifications (Excerpt)】 ■ Device dimensions: 108(W) × 86(D) × 104(H) cm including monitor ■ Weight: 455 kg ■ Power supply: Three-phase 208-240V 50/60Hz 50A ■ Control temperature: 100–500℃ ■ Heating area: 305 × 305 mm ■ Chamber depth: 99 mm ■ Process gas line: N2 (optional Ar He, forming gas) Formic acid compatible system (optional) *For more details, please refer to the PDF document or feel free to contact us.