Film Attachment Device | Semi-Automatic Mounter FM-664 Series
A device that can accommodate both pre-cut tape and normal tape.
The FM-664 series has been developed as a device that can accommodate both pre-cut tape and normal tape. Two types of wafer sizes are available: ■ FM-6648: Up to 8 inches ■ FM-6643: Up to 12 inches This device can instantly attach various tapes to silicon wafers and dicing frames without bubbles. It has been developed to support both pre-cut tape and normal tape. It can be used not only as a dedicated device for pre-cut tape or normal tape but also as a versatile device that can handle the applications listed below.
basic information
■Features - Adjustable settings for attachment pressure, speed, temperature, and other conditions - Variable attachment pitch for normal tape - Tension-free attachment - Bubble-free attachment - Non-contact surface attachment capability - Static electricity countermeasure device - Compact, lightweight, small footprint ■Benefits The main benefits of introducing a wafer mounter include "stable attachment quality," "speedy manufacturing operations," and "prevention of chip flying." By fully utilizing these features, an increase in productivity due to high yield is expected. Operators only need to set the wafer and frame and press start. Additionally, it serves as a dual-purpose device.
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Delivery Time
Model number/Brand name
FM-6648
Applications/Examples of results
■Applications - Shared use of pre-cut tape and normal tape for dicing applications - Dedicated pre-cut tape for dicing - Dedicated normal tape for dicing - Pre-cut DAF and dicing integrated tape - Normal DAF and dicing integrated tape - Standalone DAF tape - Back grind tape / BG tape - Surface protection tape - Backside protection tape - Functional films (resist films, CSP film sealing, underfill films, etc.) 【Dicing Applications】 After wafer dicing by a dicer, dicing tape is applied to the backside to hold the wafer being cut during dicing, preventing the chips from becoming dislodged. 【Protection (Back Grind / BG) Applications】 When performing back grinding on the backside of the wafer for thinning, protective tape is applied to protect the circuits on the surface. 【Others】 Other roll-type films can be accommodated with film application (such as DAF application, resist film application, etc.).
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| Model number | overview |
|---|---|
| FM-6648 | Up to 8 inches | Device dimensions: 1,220mm (W) x 660mm (D) x 1,620mm (H) |
| FM-6643 | Up to 12 inches | Device dimensions: 1,710mm (W) x 975mm (D) x 1,570mm (H) |
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Techno Vision Co., Ltd. has been engaged in the development, manufacturing, and import/export of its own products, focusing on cleaning technology and assembly technology since its establishment in September 1987. In today's high-tech industry, we are committed to responding to our customers' needs and providing technology, products, and services from the perspective of our customers.