Post-assembly process

Post-assembly process
Introduction of assembly equipment products used in the latter stages of the semiconductor manufacturing process ◆ Multifunctional film application device (wafer mounter) ◆ Wafer expander ◆ UV film curing device - high-pressure mercury lamp specification ◆ UV film curing device - blacklight specification ◆ UV film curing device - LED light source specification ◆ Grip ring
1~15 item / All 15 items
-
Film Attachment Device | Manual Mounting Machine FM-224 Series
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
last updated
-
Film Attachment Device | Semi-Automatic Mounter FM-664 Series
A device that can accommodate both pre-cut tape and normal tape.
last updated
-
Film Attachment Device | Semi-Automatic Mounter "FM-903S"
Semi-automatic tabletop type wafer mounter for up to 8 inches.
last updated
-
Film Attachment Device | Semi-Automatic Mounter "FM-3343"
Auto-lamination without bubbles under preset pasting conditions.
last updated
-
Manual Pre-Cut Tape Mounting Machine PFM-9008
Manual wafer mount for pre-cut tape.
last updated
-
Vacuum Film Application Device | LP Tape Mounting Machine
Introduction of the vacuum film application device! It solves the problem of damage caused by rollers.
last updated
-
Wafer Expansion Device | Wafer Expander TEX-21 Series
An air cylinder is used for driving the extension stage. The simple design achieves maintenance-free operation.
last updated
-
Wafer Expansion Device | Wafer Expander TEX-220
A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.
last updated
-
Wafer Expansion Device | Wafer Expander EX-300
A 12-inch compatible wafer expander using a motor drive system. Support for up to 8 inches is also available.
last updated
-
UV (Ultraviolet) Film Curing Device | LED Light Source Specification "UVC-300"
Long lifespan with LED light source! Emits ultraviolet (UV) light at a wavelength of 365nm.
last updated
-
UV Film Curing Device | Fully Automatic LED Light Source Specification "UVC-300A"
It demonstrates sufficient curing performance (cured state, curing speed) compared to high-pressure mercury lamps and metal halide light sources.
last updated
-
UV Curing Device | High Pressure Mercury Lamp Specification "UVC-408"
Compact, lightweight, small footprint device
last updated
-
UV (Ultraviolet) Curing Device | High Pressure Mercury Lamp Specification "UVC-512"
It is possible to perform uniform UV irradiation over the entire area of the wafer by rotating the work while irradiating.
last updated
-
Reinforced plastic grip ring
Double ring structure with inner ring and outer ring to maintain an expanded state.
last updated
-
Wafer case | Grip ring case
Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.
last updated