[Technical Information] Tips for Uniform Tape Application on Wafers
Introduction to the tape application process in the dicing process.
The "Tape Mount Handbook" is a technical document from Techno Vision, which develops and sells semiconductor manufacturing equipment, cleaning equipment, and post-process assembly equipment. This document includes an overview of the "Tape Application Process in the Dicing Process," as well as solutions to issues and details about the equipment. [Contents (partial)] ■ Overview ■ Tape Application ■ In the case of manual application ■ If you are already using a tape mount ■ Techno Vision manufactured mount *For more details, please refer to the PDF document or feel free to contact us.
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[Device Contents] ■ Techno Vision Mounting Machine FM Series ■ Dicing and Singulation Processes ■ Back Grinding Process, Surface Protection ■ Die Bonding, Die Attach Film * Each device is available in three models according to work size. * Various options (ionizers, heaters, etc.) are available. * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Techno Vision Co., Ltd. has been engaged in the development, manufacturing, and import/export of its own products, focusing on cleaning technology and assembly technology since its establishment in September 1987. In today's high-tech industry, we are committed to responding to our customers' needs and providing technology, products, and services from the perspective of our customers.