【Lechler and Sonosys】 (Case Study) Spray nozzles from Lechler and Sonosys for semiconductor manufacturing equipment 【Precision spray nozzles and ultrasonic spray nozzles】 (Improvements/Enhancements) 0016

ティックコーポレーション 本社
Various spray nozzles are required for semiconductor cleaning equipment. High-efficiency cleaning is necessary to prevent quality degradation during wafer cleaning. Additionally, when cleaning with liquids (such as pure water or chemicals), precision spray nozzles are required. Many spray nozzles are used. Furthermore, in addition to conventional pressurized spray nozzles, the use of ultrasonic (megasonic and ultrasonic) cleaning has been increasing recently. This time, we present examples using precision spray nozzles from Lechler and ultrasonic spray nozzles from Sonosys. Both companies have numerous achievements with renowned semiconductor equipment manufacturers. We would be grateful if you could consider them.


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Related Links
This is the company introduction of Lechler.
This is a video of the ultrasonic spray nozzle made by Sonosys. (The product used in the video is US-1.)
This is the introduction page for Lechler's spray nozzle for semiconductors.
This is the introduction page for Sonosys's megasonic and ultrasonic spray nozzles.
This is the homepage of Tic Corporation's Spray Solution Division.
This is the introduction page for Tic Corporation's ultrasonic spray nozzles. We offer two types: made by Sonosys and Sonia.