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Ultrathin film formation technology - Atomic Layer Deposition

Designed for R&D activities and industrial-scale mass production! We provide custom-made reactor tools.

Atomic Layer Deposition (ALD) is a special coating method within CVD. The complementary and self-limiting surface reactions in the ALD process provide uniform films with controlled thickness down to the nanometer scale and excellent step coverage on complex 3D surface geometries. For ALD processing, FHR Anlagenbau GmbH offers custom-made reactor tools designed for R&D activities and mass production on an industrial scale. [Coating Method] ■ Performed by alternating substrate exposure to at least two chemical reactants (precursors) ■ The first precursor is flashed onto the substrate ■ The precursor reacts with reactive surface sites until there are no unreacted surface sites left (saturation) ■ The gaseous reaction byproducts of the first precursor are purged with inert gas ■ The second precursor is flashed, and surface reactions occur again until saturation is reached ■ After purging the reaction, in the case of residuals from the second precursor, the cycle is resumed by flashing the first precursor *For more details, please refer to the PDF document or feel free to contact us.

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FHR Anlagenbau GmbH Atomic Layer Deposition (ALD)

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FHR Anlagenbau GmbH Atomic Layer Deposition (ALD)

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