Improving Sealing Performance of Insert Material "Sealing Tape HT56 for Insert Molding"
Improved adhesion strength and sealing properties without curing process by mold temperature and sealability during resin molding. Surface modification and potting are not required
[Features] - Improving sealing and adhesive performance without curing process due to mold temperature and heat during resin injection molding - Because the tape itself is slightly sticky, temporary lamination with metal insert materials is possible at room temperature - No surface modification or potting - Applicable to various materials Metals: Aluminum, stainless steel, copper, steel, etc. Resin: PPS, PBT, PA, etc. [Application] - Insert molded products such as connectors, bus bars, and terminal blocks - Resin and metal composite parts such as car interior panels
basic information
＊For more detailed information on physical properties, usage, etc., please refer to the catalog or feel free to contact us.
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Applications/Examples of results
- Insert molding products such as connectors, bus bars and terminal blocks - Resin and metal composite parts such as car interior panels
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News about this product（2）
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We will exhibit at the "2026 Automotive Technology Exhibition" in YOKOHAMA.
Our company will be exhibiting at the "Automotive Technology Exhibition 2026." This exhibition will be held in Yokohama in May and in Nagoya in June. A web-based exhibition will also take place at the same time. We warmly invite you to visit our booth. We sincerely look forward to your attendance. 【Exhibited Products】 ■ Cellulose fiber composite resin "Green Chip® CMF®" contributing to sustainability ■ Thin and easy to process "Ceramic fiber sheet / Fireproof, thermal insulation, and burn prevention sheet" ■ Improved adhesion and sealing performance with insert materials "Sealing tape HT56 for insert molding" ■ By heat bonding, it addresses adhesion of dissimilar materials and electrocorrosion prevention "Quasi-structural adhesive tape (electrocorrosion prevention type)"
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We will exhibit at "Neo Functional Material 2026"
We will be exhibit at "Neo Functional Material 2026," which will be held from Wednesday, January 28 to Friday, January 30, 2026. We look forward to seeing you at our booth. [Exhibited Products] -Gap-free, flexible radiation shielding material "Tungsten Powder Holding Sheet" -Durable lightweight sheet material for harsh environments "Stainless Fiber Sheet Filter" -The "snap-in" structure streamlines the installation of heaters on small-diameter pipes "Half-split Heater for Small-diameter Pipes" -Thin and strong adhesion, available from 5µm "Thermo-setting Electrical Insulation Film SJ41" -Improved sealing performance for insert materials "Sealing Tape HT56 for Insert Molding"
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In June 1914, TOMOEGAWA started its path as a pioneer of industrial specialty paper in Japan, and succeeded in domestic production of “electrical insulating paper and telecommunications paper” to meet the needs of telecommunications industry. In the 1960s, we earned a reputation as a 'Tomoegawa of Specialty Paper' by developing papers for multiple industries, with our strength in integrated production from wood pulp. Since then, TOMOEGAWA has developed "papermaking, coating, adhesive, powder" technologies and expanded its business domains to "highly functional materials." In recent years, with the spread of 5G, advanced driver assistance systems, etc., and the promotion of DX, many electronic parts require control for high voltage, high current, high frequency. TOMOEGAWA has expanded our "iCas" brand products that control "heat, electricity, and electromagnetic waves" to produce various solutions for heat, noise, etc. TOMOEGAWA has also formed “GREEN CHIP” brand, focusing on new products that contribute to the conservation of the natural environment and control of manufacturing and operating environments. In addition, we have changed our company name from TOMOEGAWA Co., Ltd., to TOMOEGAWA CORPORATION on January 1, 2024, in order to clarify the actual situation of our company and aim for sustainable corporate growth.