[New Development] One-component Heat-Curing Epoxy Resin TE-5111K
This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]
TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.
basic information
Newly developed liquid black epoxy resin - Low linear expansion coefficient (15ppm/K) - Low shrinkage (<0.03) - High heat resistance (Tg point 168℃) - Short curing time (130℃/5 minutes)
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Applications/Examples of results
【Usage】 ■Sealing and bonding of electrical and electronic components.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.