寺田 Official site

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

basic information

Newly developed liquid black epoxy resin - Low linear expansion coefficient (15ppm/K) - Low shrinkage (<0.03) - High heat resistance (Tg point 168℃) - Short curing time (130℃/5 minutes)

Price range

Delivery Time

Applications/Examples of results

【Usage】 ■Sealing and bonding of electrical and electronic components.

TE-5111K Low thermal expansion coefficient short-term curing high heat resistance

TECHNICAL

[Updated on 2024/8/1] Introduction to TERADITE

TECHNICAL

Recommended products

Distributors

Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.