[New Development] Two-Component Room Temperature Curing Epoxy Resin TE-7172K3
Room temperature curing × High thermal conductivity 3.3W/mK × Flexibility! An epoxy resin suitable for stress relief. Ideal for gap filler applications, flame retardant equivalent to V-0.
The TE-7172K3 is a two-component, room-temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It can cure at 25°C without the need for heating equipment, making it energy-efficient and adaptable to flexible production processes. Its most notable feature is its high thermal conductivity of 3.3 W/m·K, which is effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb stress and prevent cracking in substrates and modules. The cured material exhibits balanced properties with a glass transition temperature of -20°C, a coefficient of linear expansion of 24 ppm/K, and a Shore D hardness of 45, combining heat resistance and flexibility. Moreover, it has flame retardant properties (equivalent to UL94 V-0 at 5mm thickness), making it safe for use in electronic devices that require safety. This improved version enhances heat resistance and toughness while inheriting the features of the conventional TE-7172K2. Applications include gap fillers, heat dissipation insulation materials, and encapsulation of electronic components where stress relief is required.
basic information
【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:5) ■ High thermal conductivity: 3.3W/m·K (suitable for heat dissipation measures) ■ Balances flexibility and heat resistance, effective in preventing cracks ■ High insulation properties (dielectric breakdown strength over 16.5kV/mm, volume resistivity > 1×10¹⁰Ω·cm) ■ Flame retardant: Equivalent to UL94 V-0 (5mm thickness) * For details, the product specification sheet is available for download as a PDF from the link below, or please contact us. * Samples are also available, so please contact us if needed.
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Applications/Examples of results
【Usage】 ■ Heat dissipation insulation material for electronic and electrical devices ■ Gap filler
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.