High Thermal Conductivity Epoxy Resin for Semiconductors TE-7163
For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.
In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially shortening product lifespan. TE-7163 efficiently dissipates heat generated by semiconductor devices to the outside due to its high thermal conductivity, thereby improving device reliability. 【Application Scenarios】 - Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors. 【Benefits of Implementation】 - Prolonged device lifespan - Enhanced product reliability - Stable performance maintenance
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【Features】 - High thermal conductivity - Quick curing - Low viscosity 【Our Strengths】 Terada Corporation has been providing its own products and materials to various industrial fields, focusing on electronic devices and chemical products. Utilizing our long-standing know-how in resin and adhesive technology within the electronics industry, we contribute to solving our customers' challenges.
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【Purpose】 ■ Heat dissipation insulation sealing for electronic components such as motors, coils, transformers, and capacitors.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.