High Thermal Conductivity Epoxy Resin TE-7900 for Semiconductors
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. The rise in heat generation can lead to performance degradation and a shorter lifespan of devices, making it necessary to efficiently dissipate heat. TE-7900 enhances the heat dissipation of semiconductor devices due to its high thermal conductivity, contributing to improved reliability. 【Usage Scenarios】 - Heat dissipation insulation sealing for CPUs, GPUs, power semiconductors, etc. - Heat dissipation for high-power LEDs - Potting for various electronic components 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Assurance of high reliability
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【Features】 - High thermal conductivity (3W/mK) - Low viscosity, excellent workability - Environmentally friendly (non-lead, non-halogen) - Low thermal expansion, resistant to cracking 【Our Strengths】 Terada Corporation has many years of experience in the electronic devices and chemical products fields. We provide product proposals tailored to customer needs and technical support.
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【Purpose】 ■ Heat dissipation insulation sealing for electronic components such as motors, coils, transformers, and capacitors.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.