High thermal conductivity epoxy resin for semiconductors TE-7127
Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.
In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. Heat can lead to performance degradation and failure of devices, potentially compromising product reliability. TE-7127 achieves both high thermal conductivity and excellent insulation, contributing to improved heat dissipation performance of semiconductor devices and enhancing product reliability. 【Application Scenarios】 - High-performance processors such as CPUs and GPUs - Power semiconductor devices - LED lighting 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Stabilization of performance
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【Features】 - High thermal conductivity - Quick curing - Environmentally friendly (non-lead, non-halogen) - Low thermal expansion - Flame retardancy equivalent to V-0 【Our Strengths】 Terada Corporation has many years of experience in the electronic devices and chemical products fields. We provide optimal products tailored to our customers' needs and also offer technical support.
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【Purpose】 ■ Heat dissipation insulation sealing for electronic components such as motors, coils, transformers, and capacitors.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.